Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface

Joint Design and Cointegration

authored by: Wonbin Hong, Rob Maaskant, Duixian Liu, Hua Wang, Atif Shamim, Bart Smolders, Dirk Michael Manteuffel, Yueping Zhang
Abstract: The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.
Organisation(s): Institute of Microwave and Wireless Systems
External Organisation(s): Pohang University of Science and Technology
Eindhoven University of Technology (TU/e)
IBM
Georgia Institute of Technology
King Abdullah University of Science and Technology (KAUST)
Nanyang Technological University (NTU)
Type: Editorial in journal
Journal: IEEE Antennas and Wireless Propagation Letters
Volume: 18
Pages: 2345-2350
No. of pages: 6
ISSN: 1536-1225
Publication date: 11.2019
Publication status: Published
Peer reviewed: Yes
ASJC Scopus subject areas: Electrical and Electronic Engineering
Electronic version(s): https://doi.org/10.1109/lawp.2019.2945829 (Access: Closed)
: Details in the research portal "Research@Leibniz University"

BibTeX

@article{8aab38275a374d43921af855e2ad8d49,
title = "Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface: Joint Design and Cointegration",
abstract = "The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.",
author = "Wonbin Hong and Rob Maaskant and Duixian Liu and Hua Wang and Atif Shamim and Bart Smolders and Manteuffel, {Dirk Michael} and Yueping Zhang",
note = "Funding information: This Special Cluster would not have been possible without spectacular teamwork. The guest editors sincerely express their gratitude to Prof. C. Fumeaux, the Editor-in-Chief of the IEEE ANTENNAS AND PROPAGATION LETTERS, for his encouragement, consultation, and trust. In addition, we thank C. Sideri, the Editorial Assistant for her prompt support. In addition, the guest editors immensely thank all the authors who have contributed during the submission process for their enthusiasm and effort. Finally, yet importantly, we thank the reviewers for upholding the quality of this Special Cluster, which would not have been possible without their magnificent devotion.",
year = "2019",
month = nov,
doi = "10.1109/lawp.2019.2945829",
language = "English",
volume = "18",
pages = "2345--2350",
journal = "IEEE Antennas and Wireless Propagation Letters",
issn = "1536-1225",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "11",
}