Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface
Joint Design and Cointegration
- verfasst von
- Wonbin Hong, Rob Maaskant, Duixian Liu, Hua Wang, Atif Shamim, Bart Smolders, Dirk Michael Manteuffel, Yueping Zhang
- Abstract
The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.
- Organisationseinheit(en)
-
Institut für Hochfrequenztechnik und Funksysteme
- Externe Organisation(en)
-
Pohang University of Science and Technology
Eindhoven University of Technology (TU/e)
IBM Thomas J. Watson Research Center
Georgia Institute of Technology
King Abdullah University of Science and Technology (KAUST)
Nanyang Technological University (NTU)
- Typ
- Editorial in Fachzeitschrift
- Journal
- IEEE Antennas and Wireless Propagation Letters
- Band
- 18
- Seiten
- 2345-2350
- Anzahl der Seiten
- 6
- ISSN
- 1536-1225
- Publikationsdatum
- 11.2019
- Publikationsstatus
- Veröffentlicht
- Peer-reviewed
- Ja
- ASJC Scopus Sachgebiete
- Elektrotechnik und Elektronik
- Elektronische Version(en)
-
https://doi.org/10.1109/lawp.2019.2945829 (Zugang:
Geschlossen)
