Comparison of methods for broadband electromagnetic characterization of Molded Interconnect Device materials

authored by: C. Orlob, D. Kornek, S. Preihs, I. Rolfes
Abstract: Combining the Molded Interconnect Device technology with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase functionality, level of integration and to reduce costs. When taking advantage of this technology especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. In this paper different methods are therefore presented and compared with respect to their potentials for broadband electromagnetic characterization of Molded Interconnect Device materials.
Organisation(s): Institute of Microwave and Wireless Systems
Type: Article
Journal: Advances in Radio Science
Volume: 7
Pages: 11-15
No. of pages: 5
ISSN: 1684-9965
Publication date: 18.05.2009
Publication status: Published
Peer reviewed: Yes
ASJC Scopus subject areas: Electrical and Electronic Engineering
Electronic version(s): https://doi.org/10.5194/ars-7-11-2009 (Access: Open)
: Details in the research portal "Research@Leibniz University"