Characterization of Electromagnetic Properties of Molded Interconnect Device Materials

authored by: Christian Orlob, Daniel Kornek, Stephan Preihs, Ilona Rolfes
Abstract: The use of the Molded Interconnect Device technology combined with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase unctionality, level of integration and to reduce costs. When taking advantage of these technologies especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. Therefore this paper presents a broadband electromagnetic characterization of an exemplarily chosen Molded Interconnect Device material. On the basis of the measurement results a first simple antenna design is realized and its measured and simulated input reflection coefficients are compared.
Organisation(s): Institute of Microwave and Wireless Systems
Type: Conference contribution
No. of pages: 4
Publication date: 16.03.2009
Publication status: Published
Peer reviewed: Yes
ASJC Scopus subject areas: Hardware and Architecture, Electrical and Electronic Engineering
Electronic version(s): https://doi.org/10.1109/GEMIC.2009.4815856 (Access: Closed)
: Details in the research portal "Research@Leibniz University"

BibTeX

@inproceedings{a562a2810b16421b88c810a0f4587d7e,
title = "Characterization of Electromagnetic Properties of Molded Interconnect Device Materials",
abstract = "The use of the Molded Interconnect Device technology combined with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase unctionality, level of integration and to reduce costs. When taking advantage of these technologies especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. Therefore this paper presents a broadband electromagnetic characterization of an exemplarily chosen Molded Interconnect Device material. On the basis of the measurement results a first simple antenna design is realized and its measured and simulated input reflection coefficients are compared.",
author = "Christian Orlob and Daniel Kornek and Stephan Preihs and Ilona Rolfes",
year = "2009",
month = mar,
day = "16",
doi = "10.1109/GEMIC.2009.4815856",
language = "English",
isbn = "9783981266801",
booktitle = "German Microwave Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",
note = "German Microwave Conference, GeMIC 2009 ; Conference date: 16-03-2009 Through 18-03-2009",
}