LDS molded interconnect devices fit for mmwave

authored by: Aline Friedrich, Bernd Geck, Malte Fengler
Abstract: Molded interconnect devices (MID) are the three-dimensional (3D) response to the increasing market demand for components to be smaller and allied to efficient and flexible circuit carrier manufacturing. One manufacturing method for MIDs that is already common for large scale production of antennas in consumer devices, is the laser direct structuring (LDS) method. The LDS process with its laser based selective metallization processes provides great flexibility for developing electronic devices. This includes the 3D design scope in the development process, as well as the adaptability of a design during ongoing manufacturing. The substrate to be metallized by the LDS method is typically fabricated in an injection molding process using thermoplastic or thermoset materials that are doped with a special filler of mixed metal oxides. Depending on the plastic resin used, an LDS MID can be used for state-of-the-art SMT processes by applying various low or high temperature soldering methods, such as reflow. DS materials are generally suitable for RF applications and similar to a typical RF laminate, the choice of a LDS substrate material must be made by considering the specific application, taking into account both the RF and mechanical requirements. The 3D LDS process was evaluated for RF applications up to 67 GHz. The results show that the complex permittivity of the LDS polymer materials is only slightly changed due to the LDS additive.
Organisation(s): Institute of Microwave and Wireless Systems
External Organisation(s): LPKF Laser & Electronics AG
Type: Contribution in non-scientific journal
Journal: Microwave journal
Volume: 59
Pages: 116-128
No. of pages: 13
ISSN: 0192-6225
Publication date: 09.2016
Publication status: Published
ASJC Scopus subject areas: Electrical and Electronic Engineering
: Details in the research portal "Research@Leibniz University"

BibTeX

@misc{25b08c96bdba4080842d13dff4b7c49c,
title = "LDS molded interconnect devices fit for mmwave",
abstract = "Molded interconnect devices (MID) are the three-dimensional (3D) response to the increasing market demand for components to be smaller and allied to efficient and flexible circuit carrier manufacturing. One manufacturing method for MIDs that is already common for large scale production of antennas in consumer devices, is the laser direct structuring (LDS) method. The LDS process with its laser based selective metallization processes provides great flexibility for developing electronic devices. This includes the 3D design scope in the development process, as well as the adaptability of a design during ongoing manufacturing. The substrate to be metallized by the LDS method is typically fabricated in an injection molding process using thermoplastic or thermoset materials that are doped with a special filler of mixed metal oxides. Depending on the plastic resin used, an LDS MID can be used for state-of-the-art SMT processes by applying various low or high temperature soldering methods, such as reflow. DS materials are generally suitable for RF applications and similar to a typical RF laminate, the choice of a LDS substrate material must be made by considering the specific application, taking into account both the RF and mechanical requirements. The 3D LDS process was evaluated for RF applications up to 67 GHz. The results show that the complex permittivity of the LDS polymer materials is only slightly changed due to the LDS additive.",
author = "Aline Friedrich and Bernd Geck and Malte Fengler",
year = "2016",
month = sep,
language = "English",
volume = "59",
pages = "116--128",
journal = "Microwave journal",
issn = "0192-6225",
publisher = "Horizon House",
}